Nvidia B300 is coming soon: 288GB HBM3E, 50% performance improvement, TDP 1400W. SemiAnalysis
TSMC 2nm process is too expensive. The iPhone 17 equipped with the A19 series processor launched in 2025 will not use this technology. It will not be applied to the A20 and A20 Pro processors of the iPhone 18 until 2026.
In order to promote in-depth cooperation between the semiconductor and substrate industries of Taiwan and Japan, the Taiwan Printed Circuit Association (TPCA) announced that it will organize a delegation to visit Kumamoto City, Kyushu, Japan for a business trip from June 9 to 11, 2025, and will hold the “2025 Taiwan High-Tech Forum-Japan” at the Kumamoto Shinjuku Hotel on June 10.
The plan for South Korea Yongin Semiconductor National Industrial Park was approved three months ahead of schedule and will accommodate six wafer fabs, three power plants, etc.
Micron has renovated its new factory in Taichung to expand its HBM production capabilities.
OpenAI has outlined plans to overhaul its structure, saying it will create a public benefit company (PBC) to make it easier to “raise more funding” and remove restrictions on the startup from its current nonprofit parent.
Nexperia recently released a new family of next-generation fixed-direction voltage level translators ideal for use with some of the most commonly used push-pull data interfaces (including UART, SPI and JTAG protocols) as well as for general purpose input/output (GPIO).
High-bandwidth memory (HBM) technology, as the “near-memory computing/processing” stage of the upcoming “in-memory computing/processing” era, is highly valued by companies such as Samsung, SK Hynix, and Micron.
It is rumored that TSMC has once again defeated Samsung and won all orders for Qualcomm Snapdragon 8 Elite 2 chips in 2025.
