Japanese new Prime Minister Shigeru Ishiba formulated a new aid plan on November 11th, 2024 requiring the Japanese government to provide at least about US$65 billion by fiscal 2030 to support the development of the semiconductor and artificial intelligence (AI) industries. Nikkei Asia.
Tenstorrent, a US AI chip design company, reached a cooperation with the Japanese government to train 200 chip designers for Japan in the next five years recently, with a total contract amount of approximately US$50 million. Reuters.
Samsung expands HBM packaging production line, expected to be completed by the end of 2027.
Infineon announces collaboration with Stellantis on smart EV power architecture.
onsemi unveils Treo Platform for advanced power and sensing solutions.
TEL (Tokyo Electron) net profit will surge 45%, with Chinese market share reaching 45%.
Nordic Semiconductor, a Norwegian wireless communications chip supplier, announced that it would cut about 8% of its employees, or about 120 people. Nordic also reportedly decided to cancel its plan to acquire Norwegian UWB professional chip company Novelda.
Sigmaintell latest data shows South Korea OLED TV panel shipments to grow 22% to 6.48 million units in 2024.
Infineon: Revenue in fiscal 2025 is expected to be slightly lower than the $15.9 billion in fiscal 2024, which ends at the end of September 2024. Excess inventory of automotive chips.
