Intel releases security report: AMD firmware vulnerabilities increased 4.4 times, Nvidia GPU security issues increased 80%.
It is reported that TSMC plans to increase investment in its Arizona factory to prepare for mass production of 3nm/2nm chips.
EU has formulated a 200 billion euro artificial intelligence development plan and will build an artificial intelligence super factory.
Baidu Robin Li: it still requires investment in data centers and cloud infrastructure, although DeepSeek challenges the cost efficiency of large-scale artificial intelligence models.
The United States investigated the details of semiconductor equipment manufacturers sales to China and criticized Lam Research by name for non-cooperation.
Sumco will cease silicon wafer production at its Miyazaki plant in 2026.
Insight Partners: Global flexible display technology market is growing explosively and is expected to reach $173 billion in 2031.
Samsung Xi’an factory will be upgraded to 286-layer NAND flash memory process.
Allegro release new current sensor ICs in compact packages.
PassMark: Average CPU performance fell year-over-year for the first time in 20 years.
Samsung changes 1c nanometer DRAM design to ensure HBM4 mass production.
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