TSMC’s CoWoS chips are in short supply and unable to meet demand; INTEL has reportedly secured more orders for advanced packaging.
MediaTek will adopt a dual advanced packaging strategy of CoWoS and EMIB.
Jensen Huang: The next generation of AI infrastructure will require many optical connections; the partnership with Corning will “revitalize American manufacturing.”
Under pressure from the Trump administration, Tesla may be forced to shift the production of its AI 6.5 chip from TSMC to INTEL.
Quectel Wireless Solutions has sued the US Department of Defense, demanding that it be removed from the list of Chinese military companies.
OpenAI releases new model GPT-5.5-Cyber for cybersecurity teams.
French prosecutors have upgraded their investigation into Musk and X Company to a criminal investigation.
GitLab announced layoffs to save money for investing in AI agents.
The list of Trump’s delegation to China has been released, including Ammon, Cook, and Musk, but not Jensen Huang.
