Nvidia is providing a networking plug-in called Spectrum-X Ethernet for Cisco AI servers to facilitate enterprise deployment of artificial intelligence systems.
Kioxia and SanDisk have collaborated to develop 332-layer 3D NAND flash memory.
Samsung recently signed a patent licensing agreement with Yangtze Memory to develop the “hybrid bonding” technology required to stack more than 400 layers of NAND Flash, so that Samsung will use this patented technology for manufacturing starting with its 10th generation (V10) NAND Flash products (430 layers). ZDNet Korea
ADI sees strong growth in industrial, automotive, and communication sectors in Q1 FY2025.
Semiconductor equipment manufacturer ASM: China revenue share is expected to drop to 20% in 2025.
The advanced packaging capacity of Siliconware Precision Industries new factory continues to increase, and it plans to recruit 5,000 new employees.
SK Hynix announced that it has started construction of its first wafer fab in Yongin Semiconductor Industrial Park.
TrendForce: Global smartphone panel shipments are expected to reach 2.093 billion units in 2025, with mainland China accounting for more than 70%.
Guo Mingchi: Apple US AI server factory will open in 2026, and will then produce AI servers equipped with M5 high-end processors.
