President-elect Trump has announced that American entrepreneurs Elon Musk and Vivek Ramaswamy will co-lead a proposed “Ministry of Government Efficiency” after he takes office. Trump said the “Ministry of Government Efficiency” will “pave the way for dismantling government bureaucracy, cutting redundant regulations and wasteful spending, and restructuring federal agencies.”
Q3 Global Smartphone Processor Competition: High-end AI SoC leads value growth.
With the rise of AI GPUs, advanced packaging faces dual challenges of technology and environmental impact.
AMD announced a 4% global layoff, about 1,000 employees.
Renesas is the first to launch the R-Car X5 series, an automotive multi-domain fusion SoC that uses an automotive-grade 3nm process. A single chip can simultaneously support multiple automotive functional domains, including advanced driver assistance systems (ADAS), in-vehicle infotainment systems (IVI), and multiple in-vehicle applications including gateway applications.
Reuters reported that Stellantis and Leapmotor have abandoned plans to produce the second electric model B10 at Stellantis’ Polish plant, according to people familiar with the matter. The joint venture between Stellantis and Leapmotor is considering using Stellantis’ plant in Eisenach, Germany and its Trnava plant in Slovakia as alternative production bases for the B10 electric crossover.
Allegro releases advanced magnetic and inductive position sensing solutions.
Sunwoda and ST signed a MoU to jointly develop automotive BMS and other solutions. Based on STMicroelectronics’ comprehensive automotive semiconductor product line and proprietary production processes, the two parties will carry out strategic cooperation in automotive electrification, intelligent solutions and related fields for the global automotive market, especially the Chinese and European automotive markets.
The scope of LG and Tenstorrent’s contract will expand to create artificial intelligence (AI) SoC chips for smart homes, video processing and more.
