It’s reported that Samsung’s memory business will allocate approximately 70% of its capacity to long-term contracts extending to 2031.
TSMC: Demand for AI computing power grows fivefold annually; TSMC will leverage advanced logic processes, 3D Fabric, SoIC, CoWoS, and silicon photonics technologies to capture the trend in the booming infrastructure market.
Ming-Chi Kuo: NVIDIA restarts the Rubin CPX project, an inference pre-filled optimized chip.
CXMT (Changxin Memory Technologies) has begun trial production of HBM3E memory and expects its DRAM production capacity to reach 350,000 wafers per month by the end of 2026. The Information
Samsung Electro-Mechanics has won a $782.23 million order for AI server MLCCs.
BYD’s new generation 4D millimeter wave radar chip mass production.
SEMI: Investment in front-end equipment for wafer fabs could reach $220 billion by 2028.
Samsung unveils next-generation memory strategy: HBM5 targets double the performance of HBM4E.
NVIDIA CEO Jensen Huang: MediaTek processors will become the computing foundation for the next generation of Windows PCs.
