INTEL 14A’s defect density on 22nm ‘tracking better than expected’, says CFO David Zinsner
NVIDIA wins contract from Amazon to purchase 2 million AI chips.
SK Hynix is considering outsourcing some of its HBM base die manufacturing to INTEL.
TSMC continues to dominate, holding a 73% market share in Q1 & Q2 2026.
Samsung announced its roadmap for AI chip packaging: glass substrates will be commercialized as early as 2029.
ChangXin Memory Technologies has sued the US Department of Defense, demanding to be removed from the list of “military enterprises”.
Japan’s Ministry of Economy, Trade and Industry plans to request a budget of $49 billion for fiscal year 2027, with a focus on developing semiconductors and AI.
Demand for AI servers has spread to traditional packaging, and the lead-bonding packaging capacity gap may exceed 20% by 2027.
ASE has expanded its testing capabilities, driven by the demand for AI and high-performance computing.
