TSMC faces a severely short supply of 2nm capacity with order backlogs extending through 2028, and the local supply chain in Taiwan is already fully booked.
NVIDIA’s latest Vera Rubin platform will begin shipping in H2 2026, causing demand for server racks to surge threefold. Server rack manufacturers such as Chenbro Micom, JPP-KY, and CHENMING ELECTRONIC have orders extending into 2027.
INTEL notified customers that CPU prices will increase by 10%.
Musk launched the Terafab chip manufacturing project, planning to build a super foundry to leverage the computing power of space and AI.
OpenAI is partnering with McKinsey, Boston Consulting Group, Accenture, and Capgemini to accelerate enterprise adoption of AI. Business Insider
Samsung reached an exclusive HBM4 supply agreement with OpenAI, which is expected to secure a 15% share of the supply.
INTEL’s advanced packaging plant in Malaysia will begin production in 2026, with plans to launch a super-large package capable of housing 24 layers of HBM by 2028.
NVIDIA announced four Group A suppliers for cold plate cooling (Asia Vital Components, Cooler Master, Jentech, and Delta Electronics), indicating a significant increase in demand for liquid cooling.
C.C. Wei: TSMC produces 95% of the brains of robots.
