TSMC first batch of 4nm wafers in US has completed production and has been shipped to Taiwan for packaging. KAIST: HBM5 will be commercialized in 2029, and performance depends on immersion cooling. AWS will use its own ASICs to reduce…
Samsung will supply HBM3E chips to Broadcom to regain its position in the AI chip market. Nature Index 2025: China’s scientific research strength surpasses US for the second consecutive year and ranks first globally. Trump Mobile needs to be “Made…
Semiconductor Industrial Breaking News – Posted on Jun 17th, 2025-3 Meta will launch the next-generation ASIC chip MTIA T-V1 as early as Q4 2025. Huawei new “quad-chiplet package” patent was exposed, which may be related to Ascend 910D. SK Hynix has…
TSMC Arizona factory successfully shipped the first batch of Nvidia, AMD and Apple chip wafers. Samsung postponed the mass production of 430-layer NAND Flash due to manufacturing difficulties. Amazon and SK Group jointly built South Korea’s largest AI data center,…
NVIDIA will exhibit for the first time at the third China International Supply Chain Expo (CISCE) in Beijing from July 16 to July 20, 2025. Micron US DRAM output to account for 40% of total capacity amid AI-driven demand. DIGITIMES It…
OpenAI Sam Altman: We are working closely with AMD and plan to use MI450 accelerator. Taiwan has added Huawei and SMIC to its export control “blacklist”. Samsung semiconductor division has tightened ChatGPT access rights, requiring “personal approval” before use. Sony…
AMD collaborates with AI startups to accelerate innovation in chip and software design. Samsung and Micron have successively stopped production, and the spot price of DDR4 has soared by 8% in a single day. Apple modular AI glasses are gaining…
TSMC 2nm yield rate exceeds 60%, followed by Samsung at 40%, resulting in fierce competition for orders in H2 2025. Micron becomes first supplier of Nvidia SOCAMM memory chips. AMD Lisa Su: The potential market size of data center AI…
Jensen Huang announced the expansion of AI layout: Helping Europe’s computing power increase 10 times in 2 years. Samsung LSI and foundry divisions are said to be working to increase the yield of the 2nm Exynos 2600 to 50%. Micron/Amkor/SK…
AMD MI350 series: Inference performance increased by 35 times, surpassing Nvidia B200. MI400 computing power will double in 2025. Nvidia first Arm PC chip exposed: performance exceeds Qualcomm Snapdragon X Elite. Crusoe plans to spend $400 million to purchase AMD…
