TSMC plans to adopt ASML’s high numerical aperture technology in advanced process mass production starting in 2030.
Apple and Kioxia sign long-term NAND supply agreement, possibly with no price cap.
Samsung plans to apply high numerical aperture EUV to the mass production of DRAM by 2028.
INTEL announced that it has processed more than 1 million 300mm wafers using its High Numerical Aperture Extreme Ultraviolet (High-NA EUV) lithography equipment.
ASML pushes forward with upgrades to its next-generation lithography machines, targeting the large data center chip market.
Malaysia is considering using Huawei’s Ascend 910C processor to build a $494 million sovereign AI project.
Novo Nordisk Foundation will invest $62 million to build a quantum chip factory in Denmark.
Samsung’s Taylor factory will begin trial production of 2nm chips at the end of September 2026. All capacity is currently booked, with an initial monthly capacity of 50,000 wafers.
