It’s reported that SK Hynix plans to build a memory chip factory in Japan, with an investment of tens of billions of dollars. Micron CEO: Data center customer demand is approximately 150% of Micron’s actual committed supply. NVIDIA denies plans…
It’s reported that TSMC has completed the R&D and verification of its 1.6nm-class A16 process to achieve mass production in Q4 2026. Samsung adjusted foundry roadmap, postponing mass production of its 1.4nm process to 2029. Marvell has secured a major…
It’s reported that Samsung aims to be the first to complete the development of 1dnm DRAM memory by September 2026. TheBell NVIDIA announced that its Spectrum-X Ethernet silicon photonics switch has entered full production, marking the world’s first 200G/channel CPO…
SK Hynix received more than $12.04 billion in sales from NVIDIA in H1 2026, accounting for about 13% of the company’s total sales. OpenAI has pledged to deploy NVIDIA computing infrastructure on a large scale by 2030. Google accelerates the…
INTEL CEO Lip-Bu Tan: The company is researching new memory architectures and 3D stacking solutions for CPUs and memory. Samsung introduced Claude into the chip development, reducing some verification tasks from a month to two days. Synopsys became the world’s…
TSMC’s CoWoS yield exceeded 98%, and photomask size will increase 14 times by 2029. Samsung plans to commercialize high numerical aperture EUV lithography technology at the 1nm process node. SK Hynix is reportedly restarting construction of its second NAND flash…
TSMC’s 5.5x CoWoS photomask has entered the mass production stage. SK Hynix is working to advance its extreme ultraviolet (EUV) lithography technology to enable the mass production of next-generation DRAM. Microsoft may release the Maia 300 as early as September 2026…
TSMC is reportedly in talks to acquire AUO’s two panel factories to expand advanced packaging capacity. SK Hynix has confirmed that its V10 NAND flash memory uses a 375-layer stacked structure and incorporates wafer bonding technology. Qumulus AI and Agentic…
TSMC accelerates 3nm process shipments, aiming to reach 180,000 wafers and the 2nm process shipment target is 100,000 wafers in Q4 2026. Wedbush NVIDIA is reportedly considering reducing the memory configuration of Rubin Ultra GPUs due to a shortage of…
NVIDIA accelerates its AI-RAN deployment and urgently needs to collaborate with Chinese AI base station suppliers to develop 6G AI base stations. It’s reported that TSMC is unable to package Apple’s $1 billion processor, due to a shortage of DRAM chips. Anthropic assembled…
