SK Hynix: Yield in the HBM hybrid bonding process has improved. DNA molecular computers have broken through the limitations of 2nm semiconductor technology. US has suspended the supply of chip equipment to Hua Hong Semiconductor. Samsung’s plan to withdraw from…
TSMC: Expanding capacity at “double speed”, with 2nm production expected to grow by about 45% in the first year. CPU shortages have forced INTEL to sell chip “scrap” for profit. Google will build its first global AI park in South…
DeepSeek V4 switched to Huawei chips, abandoning NVIDIA chips. Samsung purchases DRAM hafnium materials from SK Group for the first time. Meta will use hundreds of thousands of AWS Graviton chips in AI infrastructure deployment. Alibaba’s Qwen will be available…
Intel CEO Lip-Bu Tan: Xeon server CPUs are expected to maintain strong growth momentum over the next two years. Samsung and Kingston have announced price increases for solid-state drives (SSDs), with increases of at least 10%. Microsoft will invest $18…
TSMC will begin mass production of 1.3nm semiconductors in 2029. OpenAI has released a chip patent that includes 20 HBM memory stacks. Qualcomm CEO Cristiano Amon visited South Korea to discuss cooperation with Samsung on 2nm chip manufacturing. Tesla CEO…
TSMC unveils its latest roadmap: A12, A13 and N2U process technologies released; high numerical aperture EUV will be discontinued by 2029. Google’s eighth-generation TPUs include the TPU 8t, focusing on training, and the TPU 8i, specializing in inference. Both will…
TSMC has been steadily increasing its 3nm capacity to meet the surge in demand for both CPU and AI ASIC production. Samsung increases GDDR6 production to supply Tesla. AMD will partner with GlobalFoundries to develop CPO solutions. Powerchip Technology: Collaborating…
Samsung has indefinitely postponed mass production of the HBM5E due to substandard yield rates. SK Hynix’s advanced packaging plant began construction in April 2026. Amazon has reduced the construction time for its AI data centers from 15 weeks to 3…
SK Hynix: It has begun mass production of 192GB SOCAMM2 memory modules designed specifically for NVIDIA’s next-generation Vera Rubin AI chip. INTEL is about to launch the 14A process, and UBS speculates that its customers may include NVIDIA and Apple.…
TSMC’s 2nm capacity is already saturated, while Samsung’s foundry services are targeting customers’ replacement needs. The market expects TSMC’s sub-1nm process to enter the trial production stage in 2029. Samsung plans to deliver HBM4E chip samples to NVIDIA in May…
