Huawei plans to officially enter the South Korean AI hardware market in Q4 2026, launching the Ascend 950 series chips and the Atlas 950 SuperPod computing platform. LG Energy Solutions’ joint venture with Honda in the US has shifted to…
Samsung plans to raise DRAM prices by 20% in Q3 2026; its customers received verbal notification. The global storage market is expected to reach approximately $269.23 billion in Q2 2026, representing a year-on-year increase of 380%. Counterpoint Research Micron is…
INTEL wins Google’s next-generation TPU packaging order. TSMC will reinvest $20 billion in TSMC Arizona to build a 12-inch wafer fab and advanced packaging plants. Samsung reportedly secured over $6.54 billion in orders from Meta for manufacturing 2nm AI chips.…
Samsung reiterated its foundry roadmap: mass production of 1.4nm process in 2029 and enhanced SF1.4+ process in 2030. SK Hynix plans to invest $51.46 billion to build new NAND chip factories by 2029. Apple is in talks to buy memory…
It’s reported that NVIDIA has cancelled the quad-GPU version of Rubin Ultra and will instead use a dual-GPU design. Samsung’s HBM4E yield rate exceeds 70%, and the development of the seventh-generation AI memory has entered a stable stage. Goldman Sachs…
NVIDIA GeForce RTX GPUs re-released in the US, Samsung Electro-Mechanics will expand its FC-BGA production capacity at its Busan plant in South Korea. SK Hynix plans to order semiconductor testing equipment, with a total value of $257.86 million. It’s reported…
Morgan Stanley estimates that AMD EPYC Venice processors will ship 6.75 million units by 2027, 17% more than NVIDIA Vera processors. South Korea President Lee Jae-myung: We will accelerate the construction of AI infrastructure and promote the development of chips,…
TSMC’s CoWoS technology holds a 95% market share. Qualcomm and Meta announced a multi-generational strategic partnership agreement for data center CPUs. TSMC accelerates the development of its local DRAM supply chain, with Winbond Electronics assisting in the supply of memory…
TSMC and INTEL are accelerating their investments in glass substrate and panel-level packaging. OPENAI partnered with Broadcom to launch its first custom AI chip, Jalapeño; saving 50% on costs. IBM: Nano-stacking technology at sub-nanometer nodes is expected to be mass-produced…
SK Hynix will slow down the mass production of HBM4 and instead expand into the general DRAM market. Masayoshi Son: ARM will enter the chip manufacturing. The Netherlands has joined Pax Silica, a US-led initiative to collaborate on AI supply…