It’s reported that NVIDIA has cancelled the quad-GPU version of Rubin Ultra and will instead use a dual-GPU design. Samsung’s HBM4E yield rate exceeds 70%, and the development of the seventh-generation AI memory has entered a stable stage. Goldman Sachs…
NVIDIA GeForce RTX GPUs re-released in the US, Samsung Electro-Mechanics will expand its FC-BGA production capacity at its Busan plant in South Korea. SK Hynix plans to order semiconductor testing equipment, with a total value of $257.86 million. It’s reported…
Morgan Stanley estimates that AMD EPYC Venice processors will ship 6.75 million units by 2027, 17% more than NVIDIA Vera processors. South Korea President Lee Jae-myung: We will accelerate the construction of AI infrastructure and promote the development of chips,…
TSMC’s CoWoS technology holds a 95% market share. Qualcomm and Meta announced a multi-generational strategic partnership agreement for data center CPUs. TSMC accelerates the development of its local DRAM supply chain, with Winbond Electronics assisting in the supply of memory…
TSMC and INTEL are accelerating their investments in glass substrate and panel-level packaging. OPENAI partnered with Broadcom to launch its first custom AI chip, Jalapeño; saving 50% on costs. IBM: Nano-stacking technology at sub-nanometer nodes is expected to be mass-produced…
SK Hynix will slow down the mass production of HBM4 and instead expand into the general DRAM market. Masayoshi Son: ARM will enter the chip manufacturing. The Netherlands has joined Pax Silica, a US-led initiative to collaborate on AI supply…
It’s reported that TSMC plans to increase the price of its advanced manufacturing processes by 5% to 10%. Samsung HBM4 sales are expected to exceed $1.2 billion by the end of June 2026. NVIDIA B200 rental prices drop by more…
Samsung has released its UFS 5.0 product. Storage technology upgrade: Advanced packaging becomes the key to success. According to supply chain sources, the monthly production capacity of TSMC’s main 28nm production base, Fab 15A, has decreased by more than 25%…
It’s reported that TSMC will build a packaging and testing plant at the Central Taiwan Science Park’s Erlin Campus. Masayoshi Son: Space data centers are not very meaningful; Earth’s computing power will determine the AI race. NVIDIA targets the $200…
TSMC will utilize 3nm process to manufacture RTX SPARK PC chips for NVIDIA. NVIDIA will collaborate with MediaTek to jointly develop the RTX SPARK PC chip and computers powered by the chips will be available in autumn 2026. INTEL plans…
