Meta paid Broadcom $2.3 billion in 2025. Samsung to phase out LPDDR4/4X, shifts focus to LPDDR5 and advanced DRAM. The combined revenue of the top 10 global semiconductor equipment manufacturers exceeded US$130 billion by 2025. CINNO • IC Research BYD…
Meta has increased the price of its Quest VR headset, as memory chip prices are rising. Sony’s image sensor factory in Kumamoto will receive a subsidy of $380 million from the Japanese government. Tesla is hiring engineers in Taiwan, requiring…
TSMC: Advanced packaging capacity is extremely tight. OpenAI has once again abandoned its “Stargate” project in Norway; Microsoft has taken over and gained computing power from 30,000 NVIDIA chips. Stellantis has signed a five-year partnership agreement with Microsoft to jointly…
C.C. Wei discusses the competition between Terafab and INTEL: No shortcuts to expanding production capacity. The industrialization of glass substrates is accelerating: TSMC is building a pilot project for a CoPoS packaging production line. Musk has demanded that the Terafab…
TSMC C.C. Wei discusses pricing strategy: No major price adjustments. Jensen Huang: The input is electronics, the output is tokens, and NVIDIA is in the middle. Tesla has completed the tape-out of its AI5 chip, which will be manufactured by…
Goldman Sachs: The memory supercycle is expected to continue until 2027. Samsung has begun providing customers with samples of GDDR7 memory with speeds of 36 Gbps and a single-chip capacity of 24Gb (i.e., 3GB). Musk stated that Tesla has completed…
Samsung Electro-Mechanics plans to build an MLCC embedded substrate production line in Vietnam to expand AI packaging capacity. Broadcom and Meta have signed a multi-year AI chip collaboration agreement. South Korean memory chips face a major risk: Israel’s bromine supply…
NVIDIA denied acquiring Dell and HP. The spot rental prices of NVIDIA’s entire range of GPUs in cloud data centers have increased significantly. Ornn SEMI: Global semiconductor manufacturing equipment sales will reach $135.1 billion by 2025, a 15% increase. The…
It’s reported that Samsung’s 2nm process yield is currently around 55%. UBS has raised its forecast for Broadcom’s 2027 TPU shipments to 7 million units. Samsung SDI may supply batteries to Mercedes-Benz; the two parties have entered the final stage…
TSMC’s CoPoS production line is expected to be fully completed in June 2026. Samsung Electro-Mechanics will provide FC-BGA packaging substrates for NVIDIA’s Groq3 AI chip. Apple has significantly increased its SoIC capacity bookings with TSMC, targeting Baltra AI server chips.…
