TSMC’s 5.5x CoWoS photomask has entered the mass production stage. SK Hynix is working to advance its extreme ultraviolet (EUV) lithography technology to enable the mass production of next-generation DRAM. Microsoft may release the Maia 300 as early as September 2026…
TSMC is reportedly in talks to acquire AUO’s two panel factories to expand advanced packaging capacity. SK Hynix has confirmed that its V10 NAND flash memory uses a 375-layer stacked structure and incorporates wafer bonding technology. Qumulus AI and Agentic…
TSMC accelerates 3nm process shipments, aiming to reach 180,000 wafers and the 2nm process shipment target is 100,000 wafers in Q4 2026. Wedbush NVIDIA is reportedly considering reducing the memory configuration of Rubin Ultra GPUs due to a shortage of…
NVIDIA accelerates its AI-RAN deployment and urgently needs to collaborate with Chinese AI base station suppliers to develop 6G AI base stations. It’s reported that TSMC is unable to package Apple’s $1 billion processor, due to a shortage of DRAM chips. Anthropic assembled…
Q2 2026 global DRAM market share: Samsung 39%, SK Hynix 26%, Micron 25%, CXMT 7%. Counterpoint Research Elon Musk: SpaceX only uses NVIDIA GPUs exclusively because of their best performance. TSMC is further expanding its outsourcing capacity, due to insufficient…
INTEL’s EMIB-T costs 50% less than TSMC’s CoWoS, and Broadcom and Meta are also evaluating adoption. HP, ASUS, and Acer began using Changxin Memory chips. SK Hynix and SanDisk released the first HBF standard specification and showcased storage solutions for…
INTEL accelerates the construction of its Ohio wafer fab; the yield rate of its EMIB-T advanced packaging is approaching 90%. MediaTek: Its AI ASIC projects will use TSMC’s CoWoS packaging and INTEL’s EMIB-T advanced packaging. Google has announced its TPU…
TSMC collaborates with Kinsus to develop advanced packaging similar to EMIB. EU launched a tender for an AI super factory and signed letters of intent with companies such as NVIDIA to supply hardware. Kioxia began shipping samples of its ninth-generation…
Samsung: By 2026, 2nm production capacity will more than double compared to 2025. Micron offers more LPDDR5X capacity options to support next-generation edge designs. Qualcomm’s CEO: HBC Gen 1 has completed tape-out and custom chips have entered the wafer production stage. Samsung…
SK Hynix: Plans to achieve mass production of HBM4E products in 2027. AMD partnered with Core Scientific to secure up to 2.5 gigawatts of data center capacity. INTEL Foundry announced the completion of the Rapid and Reliable Microelectronics Prototyping-Commercial (RAMP-C) project.…