Q2 2026 global DRAM market share: Samsung 39%, SK Hynix 26%, Micron 25%, CXMT 7%. Counterpoint Research Elon Musk: SpaceX only uses NVIDIA GPUs exclusively because of their best performance. TSMC is further expanding its outsourcing capacity, due to insufficient…
INTEL’s EMIB-T costs 50% less than TSMC’s CoWoS, and Broadcom and Meta are also evaluating adoption. HP, ASUS, and Acer began using Changxin Memory chips. SK Hynix and SanDisk released the first HBF standard specification and showcased storage solutions for…
INTEL accelerates the construction of its Ohio wafer fab; the yield rate of its EMIB-T advanced packaging is approaching 90%. MediaTek: Its AI ASIC projects will use TSMC’s CoWoS packaging and INTEL’s EMIB-T advanced packaging. Google has announced its TPU…
TSMC collaborates with Kinsus to develop advanced packaging similar to EMIB. EU launched a tender for an AI super factory and signed letters of intent with companies such as NVIDIA to supply hardware. Kioxia began shipping samples of its ninth-generation…
Samsung: By 2026, 2nm production capacity will more than double compared to 2025. Micron offers more LPDDR5X capacity options to support next-generation edge designs. Qualcomm’s CEO: HBC Gen 1 has completed tape-out and custom chips have entered the wafer production stage. Samsung…
SK Hynix: Plans to achieve mass production of HBM4E products in 2027. AMD partnered with Core Scientific to secure up to 2.5 gigawatts of data center capacity. INTEL Foundry announced the completion of the Rapid and Reliable Microelectronics Prototyping-Commercial (RAMP-C) project.…
NVIDIA GPU prices will rise another 20% to 30%. Samsung confirmed that the HBM5 will use a 2nm GAA process, more than 50% faster than the HBM4E. NVIDIA signed a $50 billion lease agreement to build a data center in…
NVIDIA and Broadcom have begun shipping CPO switches in small batches; optical engine yield and advanced packaging capabilities are key factors. It’s reported that NVIDIA is in talks with OpenAI to provide approximately $250 billion in financial guarantees for a…
NVIDIA reportedly raises prices across its GPU bundles. BenchLife AMD Lisa Su: Helios AI server is now in full production and is expected to ship by the end of Q3 2026. SK Hynix Cheongju P&T7 clean room will be put into…
It’s reported that INTEL and AMD have signed long-term server CPU orders with Chinese customers. Bank of America predicts that by 2030, ARM-based CPUs will account for 50% of server CPU revenue. Musk: Micron has allocated a large number of…
