It’s reported that Samsung’s 2nm process yield is currently around 55%. UBS has raised its forecast for Broadcom’s 2027 TPU shipments to 7 million units. Samsung SDI may supply batteries to Mercedes-Benz; the two parties have entered the final stage…
TSMC’s CoPoS production line is expected to be fully completed in June 2026. Samsung Electro-Mechanics will provide FC-BGA packaging substrates for NVIDIA’s Groq3 AI chip. Apple has significantly increased its SoIC capacity bookings with TSMC, targeting Baltra AI server chips.…
TSMC expands its advanced packaging technologies in Taiwan, China, and the US, with CoWoS and CoPoS technologies adopted across various locations. Amazon: Invests more than $200 billion by 2026 to accelerate AI and infrastructure development. Eight Japanese companies, including SoftBank,…
It’s reported that Samsung’s 2nm process yield is declining, raising concerns about its stability. Qualcomm is considering transferring orders to TSMC. Anthropic agreed to lease CoreWeave’s AI computing power to support Claude. Amazon is considering selling its self-developed AI chip,…
Intel and Google are deepening their collaboration, from Xeon processor deployment to joint IPU development. Samsung plans to invest $4 billion to build a chip packaging plant in Vietnam. It’s reported that SpaceX’s new FOPLP factory and PCB factory are…
From defect prediction to end-to-end empowerment: INTEL is leveraging large-scale AI to reshape the core competitiveness of advanced wafer fabs. Citigroup expects SK Hynix’s operating profit to increase by 426% year-on-year in Q1 2026. Elon Musk escalates his lawsuit against OpenAI,…
TSMC’s US-based chip manufacturing plant will still ship 100% of its chips back to Taiwan; advanced packaging becomes the next bottleneck for AI. SK Hynix is actively targeting 1c DRAM: Yield rate has risen to 80%, and more than half…
Samsung’s Taylor fab begins 2nm process pilot production. TikTok plans to invest 1 billion euros to build its second data center in Finland. PIMCO plans to provide Oracle with $14 billion in debt financing for its data centers. Samsung and…
INTEL announced to join Terafab Gigafactory project, alongside companies such as Tesla, SpaceX, and xAI. AI chips drive the expansion of advanced packaging capacity, leading to a surge in demand for packaging and testing equipment. OpenAI calls on the attorneys…
