Samsung reduced wafer production and focused production on HBM chips before the strike. SK Group will invest $778.46 million in glass substrates for panel-level packaging, a new mainstream in the development of advanced AI packaging. TSMC has proposed the concept…
NVIDIA’s top-of-the-line GPU, the RTX PRO 6000, has broken the $10,000 mark, boasting up to 4,000 TOPS of computing power. China launches LineShine, a GPU-free supercomputer equipped with 2.45 million domestically produced CPU cores. TSMC is investing an additional $20…
TSMC and Sony are collaborating to develop a 3nm autonomous driving chip with the goal of achieving Level 5 fully autonomous driving. Japan plans to expand subsidies for mature process chips and remove the $190 million investment threshold. TSMC: The…
Samsung plans to begin mass production of the CXL 3.1 memory module in Q4 2026. TheElec SKC plans to raise $784.35 million to accelerate the commercialization of its glass substrates. Texas Instruments: Increasing chip production to support the rapid development…
Samsung and Kioxia’s withdrawal from the 2D NAND market has led to a supply shortage and a 300% price increase. Applied Materials and TSMC accelerate process development at the EPIC Center in the US. The war with Iran disrupted the…
TSMC board of directors approved a capital budget of approximately US$31.284 billion, primarily for advanced process capacity expansion, factory construction, and factory facility engineering. Samsung plans to restart research and investment in next-generation semiconductors. ETNews High resin raw material costs may…
TSMC’s CoWoS chips are in short supply and unable to meet demand; INTEL has reportedly secured more orders for advanced packaging. MediaTek will adopt a dual advanced packaging strategy of CoWoS and EMIB. Jensen Huang: The next generation of AI…
Apple’s self-developed 5G baseband chip has been fully deployed, with TSMC being the exclusive manufacturer of its 2nm process. Qualcomm and MediaTek reduced their wafer shipments to TSMC, while AMD benefited from the large-scale shipments of 5nm CPUs. As mobile…
SK Hynix is testing combining HBM and system semiconductors with an EMIB embedded substrate provided by INTEL. Apple has reached an agreement with INTEL, under which INTEL will manufacture chips for Apple devices. The packaging and testing industry is experiencing…
TSMC and Sony have formed a joint venture to develop and manufacture image sensors. VIS: Strong demand for AI drives pre-sale of capacity at Singapore Phase 1 wafer fab. Global OLED smartphone panel shipments grew 4.7% in Q1 2026, reaching…
