TSMC’s CoWoS chips are in short supply and unable to meet demand; INTEL has reportedly secured more orders for advanced packaging. MediaTek will adopt a dual advanced packaging strategy of CoWoS and EMIB. Jensen Huang: The next generation of AI…
Apple’s self-developed 5G baseband chip has been fully deployed, with TSMC being the exclusive manufacturer of its 2nm process. Qualcomm and MediaTek reduced their wafer shipments to TSMC, while AMD benefited from the large-scale shipments of 5nm CPUs. As mobile…
SK Hynix is testing combining HBM and system semiconductors with an EMIB embedded substrate provided by INTEL. Apple has reached an agreement with INTEL, under which INTEL will manufacture chips for Apple devices. The packaging and testing industry is experiencing…
TSMC and Sony have formed a joint venture to develop and manufacture image sensors. VIS: Strong demand for AI drives pre-sale of capacity at Singapore Phase 1 wafer fab. Global OLED smartphone panel shipments grew 4.7% in Q1 2026, reaching…
SoftBank collaborates with NVIDIA and Foxconn to build domestically produced AI servers in Japan. Jensen Huang: The next generation of AI infrastructure will require a large number of fiber-optic connections; copper wires can no longer meet demand. AI demand keeps…
Anthropic reached a computing agreement with SpaceX to use the full 300 megawatts of computing power of its Colossus 1 data center. NVIDIA and Corning entered into a long-term strategic partnership, increasing optical connectivity tenfold and including the construction of…
Samsung, SK Hynix, and Micron are actively developing MRDIMM products that may support two memory channels simultaneously. TSMC’s Fab 15A plant in the Central Taiwan Science Park will upgrade mature process technology to 4nm process. SpaceX plans to invest $55…
The surge in demand for copper-clad laminates for PCBs has led to delivery times extending to six weeks. JSR plans to build a factory in Taiwan and collaborate with TSMC to develop advanced photoresists. Rivian is considering developing its own…
Apple is reportedly considering partnering with INTEL and Samsung to produce processors. NVIDIA’s foray into physical AI will benefit the Asian supply chain. Samsung has secured a major optical module customer and may achieve CPO turnkey manufacturing in 2029. Micron…
TSMC’s 3nm capacity is projected to exceed that of 5nm by the end of 2026. TrendForce Samsung has restarted its silicon carbide (SiC) semiconductor foundry business. Apple’s recent shift in its financial strategy may signal the start of its AI…