SoftBank collaborates with NVIDIA and Foxconn to build domestically produced AI servers in Japan. Jensen Huang: The next generation of AI infrastructure will require a large number of fiber-optic connections; copper wires can no longer meet demand. AI demand keeps…
Anthropic reached a computing agreement with SpaceX to use the full 300 megawatts of computing power of its Colossus 1 data center. NVIDIA and Corning entered into a long-term strategic partnership, increasing optical connectivity tenfold and including the construction of…
Samsung, SK Hynix, and Micron are actively developing MRDIMM products that may support two memory channels simultaneously. TSMC’s Fab 15A plant in the Central Taiwan Science Park will upgrade mature process technology to 4nm process. SpaceX plans to invest $55…
The surge in demand for copper-clad laminates for PCBs has led to delivery times extending to six weeks. JSR plans to build a factory in Taiwan and collaborate with TSMC to develop advanced photoresists. Rivian is considering developing its own…
Apple is reportedly considering partnering with INTEL and Samsung to produce processors. NVIDIA’s foray into physical AI will benefit the Asian supply chain. Samsung has secured a major optical module customer and may achieve CPO turnkey manufacturing in 2029. Micron…
TSMC’s 3nm capacity is projected to exceed that of 5nm by the end of 2026. TrendForce Samsung has restarted its silicon carbide (SiC) semiconductor foundry business. Apple’s recent shift in its financial strategy may signal the start of its AI…
From 6 to 4.5µm: TSMC releases its SoIC roadmap to address bandwidth bottlenecks in AI chips. Samsung’s 4nm yield rate has reached 80%, and Groq has placed an order for LPUs. INTEL’s EMIB-T chip has achieved a 90% yield rate…
Samsung’s memory production capacity for 2027 has been completely sold out, according to reports. The resale price of the NVIDIA B300 server is as high as $1 million. Nexperia China says operations are stable after parent risk warning. Bank of…
TSMC is installing cleanrooms at its Fab 20 3rd plant in the Hsinchu Science Park, with production expected to begin in Q4 2026. Samsung: Chip supply is far from meeting customer demand, and the gap between chip supply and demand…
SK Hynix: Yield in the HBM hybrid bonding process has improved. DNA molecular computers have broken through the limitations of 2nm semiconductor technology. US has suspended the supply of chip equipment to Hua Hong Semiconductor. Samsung’s plan to withdraw from…
