SK Hynix has developed 1C LPDDR6, a sixth-generation 10nm-class DRAM. Groq plans to increase annual production of AI chips from 9,000 to 15,000. ChosunBiz Nexperia China announced that it has successfully achieved small-batch production of 12-inch wafer bipolar discrete devices.…
NVIDIA Vera Rubin chip uses only HBM4 technology from Samsung and SK Hynix. South Korea Economic Daily It is projected that by 2025, the total output value of Taiwan’s IC industry will reach US$209.1 billion, of which IC manufacturing will…
Jensen Huang stated frankly: Storage shortage is fantastic for us. In Q4 2025, NVIDIA holds a 94% share of AIB GPU, while AMD holds a 5% share. Jon Peddie Research Samsung plans to double the price of NAND flash memory…
NVIDIA Vera Rubin will adopt a fully liquid-cooled design. Morgan Stanley South Korea warns Middle East tensions could disrupt chip material supply. TI to raise chip prices from April 2026, supply chain says. Tower Semiconductor and Scintil Photonics have introduced…
NVIDIA halts H200 production for China. TSMC capacity will be transferred to Vera Rubin. US plans to expand export controls on AI chips globally, requiring companies such as NVIDIA and AMD to obtain export licenses. NAND wafer costs surged 25%…
AMD CEO Lisa Su: Server CPU demand has unexpectedly surged, and supply is currently tight. Storage sector market anticipates a two-year shortage. UBS analyst Timothy Arcuri Apple releases M5 Pro/M5 Max Macbook Pro: On-device AI computing power is increased by…
Lisa Su: AMD order growth exceeded expectations; institutional investors are optimistic about TSMC advanced process orders. Tesla plans to discuss with Samsung the possibility of significantly increasing the production capacity of its AI6 chip. TheElec SK Hynix advances new HBM…
Lip-Bu Tan strategic shift: INTEL plans to open its 18A process technology to external foundries. Jensen Huang: NVIDIA massive investment in OpenAI/Anthropic may be its last investment. Micron has launched the world’s first high-capacity 256GB LPDRAM SOCAMM2, setting a new…
Samsung introduces new power architecture to reduce HBM defect rate. Huawei releases next-generation green AI site and GW-level AIDC solution. Former TSMC executive Lo Wei-jen is under formal investigation for allegedly leaking core 2nm technology. Winbond Electronics net profit in…
Rapidus will collaborate with Canon to develop a 2nm image processing chip. Amazon will invest an additional $21 billion in Spain to build data centers and AI facilities. NVIDIA invests $4 billion in two optical technology companies, Lumentum Holdings Inc.…
