It’s reported that TSMC plans to increase the price of its advanced manufacturing processes by 5% to 10%. Samsung HBM4 sales are expected to exceed $1.2 billion by the end of June 2026. NVIDIA B200 rental prices drop by more…
Samsung has released its UFS 5.0 product. Storage technology upgrade: Advanced packaging becomes the key to success. According to supply chain sources, the monthly production capacity of TSMC’s main 28nm production base, Fab 15A, has decreased by more than 25%…
It’s reported that TSMC will build a packaging and testing plant at the Central Taiwan Science Park’s Erlin Campus. Masayoshi Son: Space data centers are not very meaningful; Earth’s computing power will determine the AI race. NVIDIA targets the $200…
TSMC will utilize 3nm process to manufacture RTX SPARK PC chips for NVIDIA. NVIDIA will collaborate with MediaTek to jointly develop the RTX SPARK PC chip and computers powered by the chips will be available in autumn 2026. INTEL plans…
Jensen Huang on Tau (τ) Law: It poses no threat to TSMC as we’re 10 years ahead. Google’s TPUs may receive an unprecedentedly large order from Anthropic. NVIDIA: Anthropic and OpenAI pioneer the adoption of the New Vera chip. INTEL…
TSMC executives stated that energy efficiency is becoming the most important consideration in chip design. ADTechnology: Samsung’s CPU processor, manufactured by the 2nm process, has a frequency of 3.695GHz. Foxconn Chairman Young Liu: By the end of 2026, the impact…
Initial test results for the NVIDIA Vera CPU show that it outperforms both AMD and INTEL. Samsung was the first to deliver samples of the 12-layer HBM4E, offering an over-20 % performance improvement. INTEL is expanding its EMIB packaging capacity…
Jensen Huang announced that NVIDIA plans to invest $150 billion annually in Taiwan. TSMC C.C. Wei: Employee bonuses and profit sharing will increase by over 30% in 2026. MediaTek is fully empowering the Agentic AI era with its next-generation edge-to-cloud…
FuriosaAI partners with Broadcom to develop next-generation 2nm inference accelerator. The MacBook Neo faces an even greater challenge: TSMC is reportedly continuing to raise the price of its 3nm process. Ming-Chi Kuo: MediaTek may become a partner of Terafab to…
It’s reported that TSMC will raise the price of its 3nm process by 15% in H2 2026, and may raise it by another 10% in 2027. Silicon Valley companies have been providing financing to SK Hynix, but SK Hynix wants…