Jensen Huang on Tau (τ) Law: It poses no threat to TSMC as we’re 10 years ahead. Google’s TPUs may receive an unprecedentedly large order from Anthropic. NVIDIA: Anthropic and OpenAI pioneer the adoption of the New Vera chip. INTEL…
TSMC executives stated that energy efficiency is becoming the most important consideration in chip design. ADTechnology: Samsung’s CPU processor, manufactured by the 2nm process, has a frequency of 3.695GHz. Foxconn Chairman Young Liu: By the end of 2026, the impact…
Initial test results for the NVIDIA Vera CPU show that it outperforms both AMD and INTEL. Samsung was the first to deliver samples of the 12-layer HBM4E, offering an over-20 % performance improvement. INTEL is expanding its EMIB packaging capacity…
Jensen Huang announced that NVIDIA plans to invest $150 billion annually in Taiwan. TSMC C.C. Wei: Employee bonuses and profit sharing will increase by over 30% in 2026. MediaTek is fully empowering the Agentic AI era with its next-generation edge-to-cloud…
FuriosaAI partners with Broadcom to develop next-generation 2nm inference accelerator. The MacBook Neo faces an even greater challenge: TSMC is reportedly continuing to raise the price of its 3nm process. Ming-Chi Kuo: MediaTek may become a partner of Terafab to…
It’s reported that TSMC will raise the price of its 3nm process by 15% in H2 2026, and may raise it by another 10% in 2027. Silicon Valley companies have been providing financing to SK Hynix, but SK Hynix wants…
NVIDIA CFO: We anticipated the surge in storage prices and placed orders in advance. SK Hynix has released its iHBM cooling solution, reducing thermal resistance by more than 30% to improve the efficiency of AI systems. Independent packaging based on…
NVIDIA, Microsoft, and Kawasaki Heavy Industries are collaborating to accelerate the large-scale deployment of physical AI in society. Micron: The sixth-generation HBM4 is ramping up production at twice the rate, and yield is improved at a faster rate. Morgan Stanley:…
NVIDIA becomes the “core” of autonomous driving, while traditional automakers are facing a crisis of “pyramid inversion”. Samsung completes prototype development of 900-layer ultra-high stacked 3D NAND flash memory. ETNews Huawei showcased a range of high-capacity SSDs based on its…
INTEL has begun developing 10A/7A process, with the 14A series expected to enter mass production in 2029. Huawei releases Semiconductor Tau (τ) Law. Microsoft’s second-generation Maia chip may receive an order from Anthropico, and the two companies are currently in…
