SoftBank is collaborating with NVIDIA and Arm to develop AITRAS, with new base stations scheduled for deployment in 2026. Interview with Jensen Huang: A complete decoupling between the US and China is unrealistic; Taiwan remains a key player in the…
NVIDIA to establish GPU R&D center in South Korea. Former Intel CEO Pat Gelsinger: 18A is a significant milestone. TSMC net profit for Q4 2025 is expected to increase by 27% to US$15.02 billion. It’s reported that LG Electronics is…
TSMC 2nm process is gaining increasing favor among customers, with its tape-out volume reaching 1.5 times that of the 3nm process. INTEL CEO Lip-Bu Tan: We are vigorously advancing INTEL 14A process and plan to achieve mass production in 2027.…
TSMC weighs further Arizona expansion with fabs and advanced packaging. TSMC manufacturing costs in US are 2.4 times higher than in Taiwan. Samsung, SK Hynix shift DRAM sales from long-term to quarterly contracts. Arm reshapes business, creates physical AI unit…
TSMC has postponed the launch of its new 3nm project and is pushing customers to switch to 2nm processes. TSMC initiates large-scale capacity transfer: It’s reported that TSMC will transfer some mature process equipment to its Singapore factory. Mass production…
Jensen Huang: Storage market architecture has been completely transformed; “AI needs more storage.” TSMC faces a shortage of 3nm process capacity: Prices are rising and new projects are being suspended. Dutch Nebius eagerness to adopt NVIDIA Rubin processor has fueled…
It’s reported that Qualcomm and Samsung are in talks regarding 2nm chips manufacturing. Musk boldly declared that Tesla will build a 2nm super foundry where staff can eat hamburgers and smoke cigars. NVIDIA releases its most powerful computing chip, Rubin;…
Jensen Huang: Blackwell and Rubin chips will be supplied to the Chinese market “in time”. Samsung warns: Shortage of memory chips will trigger a wave of price increases across the entire electronics industry. Marvell has acquired network equipment supplier XConn…
Jensen Huang: Purchase orders will indicate China’s approval of H200. Arizona has become a key region for TSMC overseas expansion, with the potential to build up to 12 wafer fabs. AMD latest Helios rack platform, to be released later 2026,…
TSMC 2nm wafer capacity: By the end of 2026, monthly output will exceed 140,000 wafers. AMD MI455 GPU: AI chip performance expected to improve 1000 times within 4 years. INTEL has announced the launch of its next-generation integrated GPU –…
