Advanced packaging market grew by 9.4% year-on-year, with 2.5D/3D packaging experiencing explosive growth due to the demand for AI. Yole Reports indicate that Amazon is in talks to invest up to $50 billion in OpenAI. To address storage shortages and…
TSMC 2nm capacity has been fully booked. Samsung and SK Hynix plan to expand advanced NAND flash memory production capacity. AMD plans to begin production of CPUs based on its 2nm process in 2026. It’s reported that Google and AWS…
Negotiations between NVIDIA and OpenAI for a $100 billion partnership have stalled. NVIDIA and MediaTek have collaborated to design specifically for AI computers. Micron, SK Hynix, and Samsung are strengthening their scrutiny of customer storage orders to prevent deliberate stockpiling.…
Jensen Huang: TSMC production capacity will at least double in the next 10 years. INTEL Song Jiqiang interprets embodied intelligence as follows: heterogeneous computing becomes the core engine, and industrialization enters a critical period. It is reported that ByteDance and…
NVIDIA, Microsoft, and Amazon are in talks to invest up to $60 billion in OpenAI. TSMC has raised its CoWoS capacity targets for 2026-2027 across the board. Jensen Huang: NVIDIA is collaborating with INTEL to develop a custom x86 processor.…
Jensen Huang: The only win-win situation is to increase TSMC production capacity instead of transferring it to US. Samsung warns: Memory chip shortage will worsen further. According to reports, Apple and NVIDIA are considering outsourcing some of their chip manufacturing…
VIS has signed a GaN process licensing agreement with TSMC; mass production will begin in H1 2028. SK Hynix expects DRAM demand to grow by more than 20% year-on-year in 2026, and NAND demand to grow by more than 15%-20%…
Samsung and SK Hynix have been in talks with Apple to significantly increase the price of LPDDR memory used in iPhones. ZDNET Korea Demand for DRAM memory capacity increased by 23% in 2026, with more than half of that growth coming…
Apple M6 chip is expected to be released soon and is expected to use a 2nm process. SK Hynix will become the exclusive supplier of the HBM3E chip for Microsoft Maia 200. NVIDIA has invested an additional $2 billion in…
TSMC has unveiled its AP7 packaging and testing facility in Chiayi for the first time, aiming to expand capacity to meet Apple orders and AI needs. INTEL: Two potential customers plan to use INTEL 14A test chip. Samsung HBM4 chip…
